These are the most frequently used words in this book.
across
air
airflow
aluminum
ambient
area
between
box
change
chassis
circuit
cm
coefficient
components
conditions
convection
cooling
cycles
cycling
determine
determined
different
electronic
english
environment
eq
equipment
expansion
factor
failures
fan
fatigue
figure
fin
flow
force
ft
ft2
heat
high
hr
increase
interface
joint
large
lead
length
level
life
loss
low
may
metric
mounted
must
number
obtained
often
pcb
plate
point
power
pressure
radiation
reduce
ref
required
resistance
result
rise
sample
section
should
shown
shows
side
since
sink
small
solder
stress
substitute
surface
system
table
temperature
test
thermal
time
transfer
two
type
units
use
used
value
velocity
vibration
watts
wire