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Electronic Failure Analysis Handbook
 
 

Electronic Failure Analysis Handbook [Hardcover]

Perry L. Martin
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Inside This Book (Learn More)
First Sentence
Failure analysis is the process of determining the cause of failure, collecting and analyzing data, and developing conclusions to eliminate the failure mechanism causing specific device or system failures. Read the first page
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Front Cover | Copyright | Table of Contents | Excerpt | Index | Back Cover
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Concordance (Learn More)
These are the most frequently used words in this book.
alloy  analysis  applications  applied  area  assembly  beam  between  board  capacitor  case  cause  change  characteristics  circuit  component  conditions  conductor  connector  contact  contamination  current  curve  damage  data  defects  design  determine  device  die  due  during  effects  electrical  electron  electronic  equipment  failure  field  fig  figure  film  heat  high  however  image  information  inspection  insulation  internal  joint  layer  lead  level  light  materials  may  mechanical  metal  method  microscope  mode  must  occur  open  optical  package  part  point  power  problems  procedure  process  product  provide  resistance  resistor  result  sample  should  solder  source  standard  stress  surface  system  table  techniques  temperature  test  testing  thermal  time  two  type  typically  use  used  voltage  wire 
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