These are the most frequently used words in this book.
alloy
analysis
applications
applied
area
assembly
beam
between
board
capacitor
case
cause
change
characteristics
circuit
component
conditions
conductor
connector
contact
contamination
current
curve
damage
data
defects
design
determine
device
die
due
during
effects
electrical
electron
electronic
equipment
failure
field
fig
figure
film
heat
high
however
image
information
inspection
insulation
internal
joint
layer
lead
level
light
materials
may
mechanical
metal
method
microscope
mode
must
occur
open
optical
package
part
point
power
problems
procedure
process
product
provide
resistance
resistor
result
sample
should
solder
source
standard
stress
surface
system
table
techniques
temperature
test
testing
thermal
time
two
type
typically
use
used
voltage
wire