Electronic Packaging Materials and Their Properties [Hardcover]

Michael Pecht (Author), Rakish Agarwal (Author), F. Patrick McCluskey (Author), Terrance J. Dishongh (Author), Sirus Javadpour (Author), Rahul Mahajan (Author)

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Product Details

Hardcover: 128 pages
Publisher: CRC Press; 1 edition (Dec 18 1998)
Language: English
ISBN-10: 0849396255
ISBN-13: 978-0849396250
Product Dimensions: 2.4 x 1.6 x 0.1 cm
Shipping Weight: 358 g

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Product Description

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

interconnections

printed circuit boards

substrates

encapsulants

dielectrics

die attach materials

electrical contacts

thermal materials

solders
Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Book Info

Provides material based on electronic packaging architectures, including semiconductor materials, materials used to interconnect and packaging the device, interconnection materials for component attachment, and hardware required to realize an electronics system. DLC: Electronic packaging--Materials.

Inside This Book (Learn More)

First Sentence
Signal processing is critical for the operation of an electronic system, and materials, along with their architectures, play an important role in the propagation of signals, especially for circuits operating at high speeds and at high electrical frequency. Read the first page

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Amazon.com: 3.0 out of 5 stars (2 customer reviews)

1 of 1 people found the following review helpful

5.0 out of 5 stars Well organized reference book, Jan 3 2000

By Rama Maiti - Published on Amazon.com

This review is from: Electronic Packaging Materials and Their Properties (Hardcover)

The material in the book is organized in a manner that makes it easy for a packaging engineer to find and use the information. It speaks the language of a practicing engineer. The reader can compare the competing materials for each application and make a decision about material choice.

The property tables are all in international units which makes it easy to compare the information from otherr sources. The book provides a detailed list of references on each topic.

It is an excellent choice as a graduate or upper level undergraduate text book for students who are beginning their studies on electronic packaging.

3 of 4 people found the following review helpful

1.0 out of 5 stars This book is not very detailed or complete., Sep 22 1999

By A Customer - Published on Amazon.com

This review is from: Electronic Packaging Materials and Their Properties (Hardcover)

This text is incomplete. It can best be characterized as an overview. The length is very short and the shallow nature of the content makes it not very useful for design work. It has truncated materials properties tables and one paragraph descriptions of the various issues packge designers are faced with.

› Go to Amazon.com to see both reviews 3.0 out of 5 stars